+ Wedge, Ball, Bump and Ribbon bonding
+ 17u to 75u Wire and 25u X 250u Ribbon
+ 6,5" TFT Touch Screen
+ Deep-Access Bond Head 16mm
+ Bond Arm Length 165mm
+ 100 Program Storage Capacities
+ Motorized Z-Axis
+ USB Backup
+ Electronic Ball Size Control
+ Pick & Place Option
+ Pull Tester Option
+ Copper Bonding Option
HB10 Thermosonic Wire Bonder for Wedge & Ball Bonding
The HB10 is a Bench Top Size Wire Bonder, ideal for laboratories, pilot and small scale production lines One Bond Head for bonding in Ball/Wedge or Wedge/Wedge bonding mode. Only tool change necessary. Easy operation with TFT Touch Screen, direct access and simple adjustment of all bond parameters.
Technical Specifications
Bonding Methode
Gold wire diameter
Aluminium wire diameter
Ribbon size
Ultrasonic system
Utrasonic power
Bond time
Bond force
Bonding tool
Motorised Wire Spool
Wire termination
Wire feed angle
Clamp movement
Ball size control
Motorized Z travel
Throat depth
Fine Table motion
Mouse ratio
Temperature controller
Electrical Requirements
Physical Dimensions
Weight
Industry Standards |
Wedge-Wedge, Ball-Wedge, Ribbon- & Bumb- bonding
17-75u (0,7-3 mil)
17-75u (0,7-3 mil)
max. 25 x 250u (1x 8 mil)
62 kHz Transducer PLL Control
0-5 Watt Output
0 - 10 sec.
5-150 cNm (350cNm option)
1,58 ? 19 mm length (0,0624” x 0,750")
50,8 mm ( 2")
Bond Head Tear / CLamp Tear
90°
Motorized, Up / Down
Electronic
17mm (0,67")
165 mm ( 6,7")
10 mm ( 0,4")
6:1
up to 250°C +/- 1°C
100 - 240V +/-10% 50/60 Hz 10A max.
680 (27")x 640 (25") x 490mm (19")
Net 42 kg
CE standards |
